Part Number | DILB32P-223TLF |
---|---|
Manufacturer | Storage & Server IO (Amphenol Communications Solutions) |
Other Part Numbers | 609-5428-ND 609-5428 DILB32P-223TLF-ND 2266-DILB32P-223TLF |
Description | CONN IC DIP SOCKET 32POS TINLEAD |
Detailed Description | 32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin-Lead Through Hole |
Manufacturer Standard Lead Time | 11 weeks |
Datasheet | Datasheet |
Category | ||
---|---|---|
Manufacturer | Storage & Server IO (Amphenol Communications Solutions) | |
Series | DILB | |
Packaging | Tube | |
Part Status | Active | |
Features | Open Frame | |
Mounting Type | Through Hole | |
Type | DIP, 0.6" (15.24mm) Row Spacing | |
Operating Temperature | -55°C ~ 125°C | |
Number of Positions or Pins (Grid) | 32 (2 x 16) | |
Termination | Solder | |
Material Flammability Rating | UL94 V-0 | |
Housing Material | Polyamide (PA), Nylon | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Tin-Lead | |
Contact Finish Thickness - Mating | 100.0µin (2.54µm) | |
Contact Material - Mating | Copper Alloy | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Tin-Lead | |
Contact Finish Thickness - Post | 100.0µin (2.54µm) | |
Contact Material - Post | Copper Alloy | |
Termination Post Length | 0.124" (3.15mm) | |
Contact Resistance | 30mOhm | |
Current Rating (Amps) | 1 A |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | DILB32P-223TLF |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 8536.69.4040 | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
REACH Status | REACH Affected | |
RoHS Status | RoHS Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
---|---|---|
1 | $1.09 | $1.09 |
15 | $0.92 | $13.80 |
30 | $0.88 | $26.40 |
60 | $0.86 | $51.60 |
105 | $0.83 | $87.15 |
255 | $0.75 | $191.25 |
510 | $0.68 | $346.80 |
1,005 | $0.60 | $603.00 |
2,505 | $0.54 | $1,352.70 |